Author: JT Smith
EE Times reports: “A CMOS device said to pack nearly all the components
needed to build a Bluetooth module will be introduced next month by Zeevo Inc., a
year-old Silicon Valley startup specializing in wireless communications ICs.
Meanwhile, chip makers are moving to incorporate Bluetooth baseband functionality
in more-integrated digital devices while leaving the radio components external.”
needed to build a Bluetooth module will be introduced next month by Zeevo Inc., a
year-old Silicon Valley startup specializing in wireless communications ICs.
Meanwhile, chip makers are moving to incorporate Bluetooth baseband functionality
in more-integrated digital devices while leaving the radio components external.”
