Anonymous Reader writes “Researchers at the IBM Almaden Research Center have achieved high-quality line patterns using deep-ultraviolet 193nm optical lithography for spaced ridges 29.9nm wide, besting the 32nm industry-consensus, theoretical (until now) limit by 2.1nm (slightly wider than the diameter of a DNA helix). Dr. Allen postulates that this “high-index immersion” variant of DUV lithography might purchase about seven years of breathing room before the industry has to rewrite Moore’s Law.”
Link: ibm.com/developerworks
