Qualcomm Snapdragon 810 Delay Rumors Return, Overheating Said to Be the Issue

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At some point last month we told you the upcoming Snapdragon 810 chip was faced with some production issues. And that this situation could bring about repercussions related to numerous new flagship devices.

The chipset was introduced back in April 2014, but we are yet to see the platform arrive in a real life product. At CES 2015, LG introduced the G Flex 2 bendy smartphone which draws life from this particular SoC.

The handset is expected to go on sale later this month in South Korea, so we… (read more)

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